Nano-Tec Titanium Nitride coated silicon wafer and glass slide
titanium Nitride coated silicon wafer and glass slide

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• Nano-Tec titanium nitride coated silicon wafer and glass slide   
  • Nano-Tec titanium nitride coated silicon wafer, Ø4inch/100mm, 525µm thickness, 50nm TiN
  • Nano-Tec titanium nitride coated microscope slide, 75x25x1 mm, 50nm TiN

The titanium nitride coated substrates are available as Ø 4”/100mm silicon wafer and microscope slide, coated with 50nm pure Titanium Nitride (99.995%). Titanium Nitride (TiN) thin films have an excellent thermal and bio stability, strength, and resistance to corrosion under extreme conditions. TiN is often applied as an effective hard coating on steel, carbide, and aluminum components. It is also used to protect sliding surfaces, as a tribological layer for cutting tools, and is an excellent non-toxic coating found in biomedical devices. Thin film TiN is also used in microelectronics, serving as both a metal and silicon diffusion layer and an excellent conductive connection between active devices and metal contacts.
For this coating, an effective low-temperature method is used for depositing ultra-pure, highly dense, and conductive TiN (~ 50-70 µΩ·cm) thin films onto glass and silicon substrates. This is achieved using a new reactive Bipolar High Power Impulse Magnetron Sputtering (Bi-HiPIMS) technology. HiPIMS uses pulsed power at very high peak power density that yields a high ionization of sputtered species. A positive reverse voltage is applied immediately after the normal negative HiPIMS pulse (“Bipolar” HiPIMS) which accelerates these ions towards the substrate surface while simultaneously exposing them to reactive N2 gas. This ion bombardment on the surface of the growing film is essential for creating a high-quality and dense TiN coating without needing to rely on extreme temperatures often required for more traditional sputtering methods.. The titanium nitride coating is not atomically flat; there are height differences in the nm range. For protection, the wafers are packed in wafer carrying trays and the slides are packed in slide mailers.

Specifications of the Nano-Tec titanium nitride coated silicon wafer and microscope slide:

Nano-Tec titanium nitride coated silicon wafer, Ø4inch/100mm, 525µm thickness, 50nm TiN Product # Unit Price* Add to Quote / Order 10-TN8140-3 Pkg/3 €1590,00 Qty:

Nano-Tec titanium nitride coated microscope slide, 75x25x1 mm, 50nm TiN Product # Unit Price* Add to Quote / Order 10-TN8631-10 pkg/10 €1590,00 Qty: